ITC Mobile Conference Guide

Tuesday Technical Sessions, 4:00

 

On this page:

• Session 4: Trojan and Counterfeit Detection 

• Session 5: Testing 3D/TSV 

• Session 6: Statistical Learning Methods

• Session 7: ATE

 

 

 

SESSION 4:  Trojan and Counterfeit Detection 

Ramesh Karri, New York University Abu Dhabi (Chair) 

Mark Tehranipoor, University of Florida (Firing Line)

Room MKB1

 

4.1  Concurrent Hardware Trojan Detection in Wireless Cryptographic ICs

Yu Liu, University of Texas at Dallas

 

 

4.2  Hardware Trojans Hidden in RTL Don’t Cares - Automated Insertion and Prevention Methodologies

Nicole Fern, University of California at Santa Barbara

 

 

4.3  PiRA: IC Authentication Utilizing Intrinsic Variations in Pin Resistance

Swarup Bhunia, Case Western Reserve University

 

 

RATE SESSION 4

 

 

 

 

SESSION 5:  Testing 3D/TSV 

Sandeep Goel, TSMC (Chair) 

Adam Cron, Synopsys (Firing Line)

Room MKB2

 

 

5.1 Survey of Test Techniques for Parametric Faults in Die-to-Die Interconnects (invited)

Shi-Yu Huang, National Tsing Hua University 

 

 

5.2  Contactless Pre-Bond TSV Fault Diagnosis Using Duty-Cycle Detectors and Ring Oscillators (invited)

Sergej Deutsch, Duke University

 

 

5.3  A DLL Based Test Solution for Through Silicon Vias (TSV) in 3D Stacked ICs

Rashid Rashidzadeh, University of Windsor

 

 

RATE SESSION 5

 

 

 

 

SESSION 6: Statistical Learning Methods 

Leroy Winemberg, Freescale (Chair)

Anne Gattiker, IBM (Firing Line)

Room MKB3

 

6.1 Third- and Fourth-Generation Test Data Analytics (invited)

Robert Daasch, Portland State University

 

 

6.2  AdaTest: An Efficient Statistical Test Framework for Test Escape Screening

Fan Lin, University of California at Santa Barbara

 

 

6.3  Wafer Level Chip Scale Package Defect Diagnosis by Machine Learning

Hao Chen, Taiwan Semiconductor Manufacturing Company

 

 

 

RATE SESSION 6

 

 

 

SESSION 7:  ATE

Greg Maston (Chair) 

Ralf Arnold, Infineon (Firing Line)

Room MKB4

 

7.1  eRNA: Refining of Reconstructed Digital Waveform

Hideo Okawara, ATE Service Corporation

 

 

7.2  Developing a Modern Platform for Test Engineering - Introducing the Origen Semiconductor Developer's Kit

Stephen McGinty, Freescale Semiconductor

 

 

7.3   An ATE System for Testing 2.4-GHz RF Digital Communication Devices with QAM Signal Interfaces

Masahiro Ishida, Advantest Corporation

 

 

RATE SESSION 7