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Thursday Technical Sessions, 2:00
 

On This Page:

  • Session 24:  Testing SOCs

  • Session 25:  Three Business Perspectives on IEEE STD 1687

  • Panel 3: Big Data for Test—Big Opportunity or Big Mystery?

  • Embedded Tutorial 2: Automotive Test Advances and ISO 26262

 

 

SESSION 24:  Testing SOCs

LeRoy Winemberg, Freescale (Chair)

Rubin Parekhji, Texas Instruments (Firing Line)

Room  MKB2

 

24.1  Test-Access-Mechanism Optimization for Multi-Vdd SoCs

Xrysovalantis Kavousianos, University of Ioannina

 

24.2   Concurrent Testing of Logic and Memory, and Detection of Memory Functional Paths in SOCs (invited)

Qihang Shi, University of Connecticut

 

24.3 High-Bandwidth DFT Fabric Requirements for Server and Microserver SoCs

Glenn Colon-Bonet, Intel

 

RATE SESSION 24

 

 

SESSION 25:  Three Business Perspectives on IEEE STD 1687

Jeffrey Rearick, Advanced Micro Devices (Chair)

Jason Doege, Centaur Technology (Firing Line)

Room MKB3

 

25.1 EDA Perspective (invited)

Presenter: Martin Keim, Mentor Graphics

 

25.2 Component Manufacturer Perspective (invited)

Presenter: Kenneth Posse, Avago Technologies

 

25.3  System Design/Manufacturer Perspective (invited)

Presenter: Krishnamoorthy Balachandran, Cisco Systems

 

RATE SESSION 25

 

  

 

PANEL 3: Big Data for Test—Big Opportunity or Big Mystery?

Li-C. Wang, University of California at Santa Barbara (Moderator and Organizer)

Room MKB1

Big Data today is undoubtedly a hot topic. For test, Big Data could mean big opportunity. However, before the big opportunity can be identified and realized in practice, practitioners often face several key questions such as: Is the data infrastructure ready? Is the data sufficient for the application? Has the data mining technology matured for the practical use? Do I need to create a new organization? What will be my expected ROI? After considering all these questions, Big Data could soon become big mystery. We have invited industrial practitioners to discuss their view on Big Data, from both the business side and the technology side. Through discussion, we hope to find out what the "low-hanging fruits" might be and what challenges to overcome in order to get to them.  

 

 

 

Panelists:

  • Kenneth Butler, Texas Instruments

  • John Carulli, GLOBALFOUNDRIES

  • Anne Gattiker, IBM

  • Xinli Gu, Huawei Technologies

  • Michael Laisne, Qualcomm

  • Phil Nigh, GLOBALFOUNDRIES

  • Srikanth Venkataraman, Intel

 

RATE PANEL 3

 

 

Embedded Tutorial 2:  Automotive Test Advances and ISO 26262

Room MKB4

 

ET2.1 TBD

Davide Apello, ST Microelectronics

 

ET2.2 TBD

Yervant Zorian, Synopsys

 

RATE EMBEDDED TUTORIAL 2

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