ITC Mobile Conference Guide
Thursday Technical Sessions, 1:30
On This Page:
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Session 17: Mixed Signal
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Session 18: Practices
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Embedded Tutorial 2: ISO 26262
SESSION 17: Mixed Signal
L. Winemberg, NXP (Chair)
R. Parekhi, Texas Instruments India (Discussant)
Room 201A
17.1 Automated Measurement of Defect Tolerance in Mixed-Signal ICs
Presenter: S. Sunter, Mentor Graphics
17.2 Automatic Test Signal Generation for Mixed-Signal Integrated Circuits Using Circuit Partitioning and Interval Analysis
Presenter: A. Coyette, KU Leuven
17.3 DE-LOC: Design Validation and Debugging with Limited Observation and Control, Pre- and Post-Silicon, for Mixed-Signal Systems
Presenter: B. Muldrey, Georgia Institute of Technology
SESSION 18: Practices
P. Maxwell, ON Semiconductor (Chair)
P. Nigh, GLOBALFOUNDRIES (Discussant)
Room 201BC
18.1 Pylon: Towards an Integrated Customizable Volume Diagnosis Infrastructure
Presenter: S. Fernandes, GLOBALFOUNDRIES
18.2 A Reconfigurable Built-in Memory Self-Repair Architecture for Heterogeneous Cores with Embedded BIST Datapath
Presenter: V. Devanathan, Texas Instruments
18.3 Active Reliability Monitor: Defect-level Extrinsic Reliability Monitoring
Presenter: M. Johnson, IBM
Embedded Tutorial 2: ISO 26262
Room 202B
ET 2.1* Overview of the Automotive Functional Safety Standard ISO 26262 Part I—Design Impact
D. Tatman, Texas Instruments
ET 2.2* Overview of the Automotive Functional Safety Standard ISO 26262 Part II—Tools and Methods
S. Mehta, Synopsys
* Invited Talk
Panel 4: ATE Revisited–Where Are We Today and Where Should We Be Heading?
Room 202CD
Every few years industry trends drive changes in the requirements for test equipment. This panel will look at trends in the last five years and the impact on ATE as well as look into the future.
B. Parnas (Moderator and Organizer)
B. Bartlett, Advantest (Discussant)
Panelists:
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P. Berndt, Cypress Semiconductor
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H. Engelhard, Advantest
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Q. Fan, Huawei
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K. Lanier, Teradyne
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J. Shelley, XCerra
Panel 5: Test, Validation and Security for IoTs
Room 202B
IoTs are expected to be pervasive in home, businesses, smart communities and cities. IoT devices are now found in commonplace amenities such as cars, phones, watches, appliances, home and business security systems, thermostats, smoke detectors, as well as applications such as utilities, banking, transportation, energy, and (bio)medical industry. The number of devices introduced in the market as IoT has increased drastically, with an estimated 50 billion by 2020, most of which are expected to be fabricated off-shore. The panel discusses the challenges that come with such large scale growth.
M. Tehranipoor (Moderator and Organizer)
Panelists:
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Y. Iskandar, Cisco Systems
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M. Schuldenfrei, Optimal+
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M. Vai, MIT Lincoln Labs
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Y. Zorian, Synopsys