ITC Mobile Conference Guide

Wednesday Technical Sessions, 8:30 a.m.

 

On this page:

• Session 3: Analog I

• Session 4: Memory

• Session 5: Analytics I

• Special Session 4: IEEE 1687.1: What, Why and How

• Special Session 5: mmWave ATE HVM Technology

 

SESSION 3:  Analog I

E. Basker, Texas Instruments (Chair)
H. Stratigopoulos, Sorbonne Universités (Discussant)

Room 201A

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3.1  Analog Fault Coverage Improvement Using Final-Test Dynamic Part Average Testing
Presenter: W. Dobbelaere, ON Semiconductor

 

3.2  Effective DC Fault Models and Testing Approach for Open Defects in Analog Circuits
Presenter: B. Esen, KU Leuven

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3.3  Fault Simulation for Analog Test Coverage
Presenter: S. Natarajan, Intel

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RATE SESSION 3

 

 

SESSION 4:  Memory

V. Chandra, ARM (Chair)

R. Aitken, ARM (Discussant)

Room 201BC

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4.1  Defect Tolerance for CNFET-based SRAMs
Presenter: T. Li, Spreadtrum Communications

 

4.2  A Built-in Self-Repair Scheme for DRAMs with Spare Rows, Columns, and Bits
Presenter: Y-X Chen, National Central University

 

4.3  EMACS: Efficient MBIST Architecture for Test and Characterization of STT-MRAM Arrays
Presenter: I. Yoon, Georgia Institute of Technology

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RATE SESSION 4

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SESSION 5  Analytics I

S. Blanton, Carnegie-Mellon University  (Chair)

J. Carulli, GLOBALFOUNDRIES (Discussant)

Room  202CD

 

5.1  Statistical Outlier Screening As a Test Solution Health Monitor
Presenter: D. Shaw, Texas Instruments

 

5.2  Accurate Anomaly Detection Using Correlation-based Time-Series Analysis in a Core Router System
Presenter: S. Jin, Duke University;

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5.3  Harnessing Process Variations for Optimizing Wafer-level Probe-Test Flow
Presenter: A. Ahmadi, UT Dallas

 

RATE SESSION 5

 

 

SPECIAL SESSION 4:  IEEE 1687.1: What, Why and How

M. Portolan, TIMA (Chair)

E. Larsson, Lund University (Discussant)

Room  202A

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S4.1* Extending the Application of IEEE 1687
Presenter: T. Waayers, NXP

 

S4.2* P1687.1—Beyond the TAP
Presenter: Nitin Parimi, Intel

 

S4.3* Opening New Portals to IJTAG Networks
Presenter: J. Rearick, AMD

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RATE SPECIAL SESSION  4

 

 

SPECIAL SESSION 5:  mmWave ATE HVM Technology

B. Bartlett, Advantest Chair and Discussant)

Room  202B

 

S5.1* Package Interconnect Options for mmWave Applications
Presenter: T. Smith, Phoenix Test Arrays

 

S5.2* Challenges with High Volume mmWave Test Cells
Presenter: J. Shelley, Xcerra

 

S5.3* Millimeter Systems for Production
Presenter: R. McAleenan, Advantest

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RATE SPECIAL SESSION 5

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* Invited Talk